MBRAUN OLED / PLED Hotplate and Coolplate Systems

The main purposes of this process tool are removal of moisture from substrates and/or the bake out/curing of coated layers. Depending on the application the maximum temperature can vary between 60°C up to 450°C. Several options are available which have to be chosen depending on the application:

Lifting pins
Required option once the hotplates are supposed to be loaded with a robot.

Proximity heating
For sensitive baking and for simulation of temperature ramping and vacuum contact the heating method of proximity heating is used. The lifting pins are driven with a servo motor in a vertical,
parallel movement. During the movement all lifting pins stay in one plane.

Vacuum suction
For immediate contact between substrate and hotplate.

Vacuum chamber
The hotplate is integrated into a vacuum chamber. In this setup an underpressure bake and an underpressure purge mode can be realized. The minimum pressure is < 0,1 mbar

Wall heating
Surrounding chamber walls of hotplate are heated to prevent condensation of solvent vapours.

Cooling function
The hotplate can be equipped with an integrated cooling circuit which can be run either with water or even liquid nitrogen. This setup enables the operator to perform a rapid cool down of the
substrate to sub-zero temperatures without changing the process station.

Glovebox integrated hotplate / coolplate systems

MBRAUN OLED Hotplate